Selective Soldering
Orissa Fusion
High-speed, in-line, multi-platform selective soldering system
Incorporating high-speed PCB transfer, the Orissa Fusion platform offers the ultimate in flexibility, coupled with reduced line length at a lower cost compared to current market offerings.
Description
The Orissa Fusion is available in two frame sizes:
Fusion Compact
The three-station cell Fusion 3 Compact – fluxer, pre-heat, solder - can be configured to handle PCBs up to 381mm x 430mm, with a larger PCB handling size available upon request. For increased soldering capability, this same unit can be configured as fluxer/pre-heat and two solder modules.
Fusion Standard
The standard four-station cell Fusion 4 – fluxer, pre-heat, solder, solder - can be configured to handle PCBs up to 381mm x 430mm, with a larger PCB handling size available upon request. For high-speed applications, this same unit can be configured as fluxer/pre-heat and up to three solder modules with as many as five heater options.
Each solder cell can be configured with any of the currently available Pillarhouse solder technologies: custom-dip, multi-dip, Jet-Wave, and single point AP down to the patented 1.5mm micronozzle.
Easy, rapid non-contact solder pot changeover is facilitated via the optional heated pot exchange trolley.
Configurations
Fusion Compact
- Fusion 3 Compact – with independent Drop-Jet jet fluxer, top & bottom IR pre-heat and single solder module (includes top side IR pre-heat above solder module)
- Fusion 3 Compact – with independent Drop-Jet fluxer and twin single solder modules (includes top side IR pre-heat above both solder modules)
Fusion Standard
- Fusion 4 – with independent Drop-Jet fluxer, top & bottom IR pre-heat and twin solder modules (includes top side pre-heat above both solder modules)
- Fusion 4 – with independent Drop-Jet fluxer and triple single solder modules (includes top side pre-heat above all three solder modules)
Standard Features
- Integral PC and Machine Mounted TFT Monitor
- In-line Motor Driven Auto Width Adjust Throughfeed Conveyor
- Auto Motorised Wire Solder Feeder & Level Detect
- DC Servo Motor Axis Drive System
- Auto Fiducial Recognition & Correction System
- Solder Wave Height Measurement System
- Auto Nozzle Conditioning System
- Process Viewing Camera
- Multilevel Password Security System
- Inerted Nitrogen System
- Pump RPM Monitoring - enabled as standard but option to disable if preferred
- Drop-Jet fluxer
- Flux Level Sensor
- Light Stack Tower
- Six AP Solder Nozzle Tips
- Internal Fume Extraction
- Colour Programming Camera
- Thermal Nozzle Calibration System using Integrated Setting Camera (requires manual correction)
- Solder Pot Coding
- PillarCOMM.NET Windows® based ‘Point & Click’ interface
- Offline programming Software
- Lead-Free Compatible
- Day-to-day Service Kit
Monitoring Options
- Flux presence sensor – thermistor style
- Flux spray, flow, and spray & flow
- O2 ppm
- Nitrogen flow
System Options
- Ultrasonic fluxing
- Dual Drop-Jet / ultrasonic fluxing
- Top side instant IR pre-heat
- Bottom side IR pre-heat
- Closed-loop pyrometer temperature control
- Large solder bath for dedicated single dip applications
- Laser PCB warp correction
- 1.5mm micronozzle
- Solder reel identification
- Larger PCB handling size
- Nitrogen generator
- PillarCARE – our comprehensive after-sale and service programme
Specifications
- Height: 1390mm / 55” to 2045mm / 80½”- with light stack
- Width: 2193mm / 86½“ Compact
- Depth: 1520mm / 60”
- Board size: 381mm x 430mm / 15”x 17” – larger size available upon request
- Edge clearance: Above / below 3mm
- Height clearance: Above / below 40mm nominal, 70mm max.
- Solder: Most commonly used solder types – including lead-free
- Solder pot capacity: 6-7kg standard – 30kg large bath
- Applicators: AP style – 2.5 – 16mm dia.
- Extended and Jet-Tip nozzles – up to 25mm dia.
- Jet-Wave nozzles – up to 25mm width
- Special dedicated nozzles available upon request
- Flux: Low maintenance Drop-Jet system. Low solids (below 8%), no clean flux, pressurised and inerted system, optional water-soluble system available
- X, Y & Z Axis resolution: 0.15mm
- Repeatability: +/- 0.05mm
- Nitrogen usage: 40 litres gas/min per bath using single bath with standard AP solder nozzle, 5 bar / 72 psi pressure.
- Nitrogen purity: 99.995% or better
- Air supply pressure: 5 bar / 72 psi
- Power supplies: Three-phase + neutral + PE
- Voltage: 230 V phase to neutral / 400V phase to phase
- Frequency: 50/60Hz
- Power: Machine configuration dependent – contact your local Pillarhouse representative
- Transport: Motorised conveyor
- Programming: PillarCOMM.NET Windows® based ‘Point & Click’ interface
Jade Handex
Quick load, twin PCB rotary table selective soldering system
Designed to meet the needs of lean manufacturing, the Jade Handex offers high-speed flexible throughput at minimal cost.
The Jade Handex is equipped with a revolutionary twin PCB rotary table transport system to allow simultaneous load / unload during product processing.
Description
Our new generation, patented drop-jet design fluxer offers quick and effective flushing of the pressurised flux chamber. This helps to keep maintenance levels to a minimum whilst enabling the use of higher solids content fluxes, as well as water-soluble fluxes.
As part of the entry-level philosophy for this system, a newly designed low maintenance solder bath and pump mechanism has been developed which moves in three axes of movement, whilst not limiting access to the PCB. Solder is applied using proven technology through our AP-1 nozzle design or custom specialised nozzles, incorporating patented spiral solder return-to-bath technology, offering reduced solder balling potential.
As with more sophisticated Pillarhouse systems, the soldering process is enhanced by an inerted hot Nitrogen curtain, providing an inert atmosphere for the soldering process, assisting the prevention of oxidation. This process provides a local pre-heat to the joint, thus reducing thermal shock to localised components.
The Jade Handex is controlled by a PC, through PillarCOMMX, a Windows® based “Point & Click” interface with PCB image display.
Additionally, our PillarPAD offline package allows the operator to produce programs independently from the machine using Gerber data.
Standard Features
- Integral PC and Machine Mounted TFT Monitor
- Inerted Nitrogen System
- Auto Motorised Solder Wire Feed & Level Detect
- Drop-Jet fluxer
- Internal Fume Extraction
- Colour Programming Camera
- Rotary Indexing Table with Twin Work Holding Positions
- Manual Fiducial Correction System
- PillarCOMMX Windows® based ‘Point & Click’ interface
- Thermal Nozzle Calibration System using Integrated
- Setting Camera (requires manual correction)
- Flux Level Sensor
- Solder Wave Height Measurement
- Pump RPM Monitoring
- Auto Nozzle Conditioning System
- Process Viewing Camera
- Multilevel Password Security System
- Light Stack Tower
- Lead Free Capability
- 9 AP Solder Nozzle Tips
- Day-to-day Service Kit
Monitoring Options
- Flux presence sensor – thermistor style
- Flux spray monitoring
- Flux flow monitoring
- Flux spray & flow monitoring
- O2 ppm monitoring
System Options
- Ultrasonic fluxing
- Dual drop-jet / ultrasonic fluxing
- Top side instant IR pre-heat
- Bottom side slide-in / slide-out IR pre-heat
- Pyrometer closed-loop temperature control
- Solder reel identification
- Solder bath coding (identifies correct bath for program)
- Fiducial recognition and correction system
- Laser board warpage control
- PillarPAD offline programming system
- Encoders on X, Y and Z axis
Specifications
- Height: 1627mm (64”) – (excluding light tower)
- Width: 1900mm (74“)
- Depth: 2508mm (99”)
- Maximum Board size: 457mm x 508mm (18” x 20”)
- Edge Clearance: Above / below 3mm
- Height Clearance: Above 95mm / below 45mm nominal
- Solder: All commonly used solder types (including Lead-Free)
- Solder pot capacity: 15kg (33lb) – standard
- Applicators: AP-1 style – 2.5mm to 16mm dia.
- Extended AP style – 2.5mm to 20mm dia.
- Micronozzle – 1.5mm to 2.5mm
- Jet-tip style – 6mm to 40mm dia.
- Jet-Wave nozzle – up to 25mm width
- Special dedicated nozzles available upon request
- Flux: Low maintenance drop-Jet system. Low solids, no clean flux, pressurised and inerted system, optional water-soluble system available
- X, Y & Z Axis Resolution: 0.15mm
- Repeatability: +/- 0.05mm
- Nitrogen usage: 30-100 litres/min. – solder nozzle configuration dependent
- Nitrogen Purity: 99.995% or better
- Power Supplies: Single phase + PE
- Voltage: 230 V
- Frequency: 50/60Hz
- Power: 10.5kVA max. – Machine configuration dependent.
- Programming: PillarCOMMX Windows® based ‘Point & Click’ interface
Jade Prodex
Ultra-flexible, offline, multi-platform, quick load twin PCB rotary table selective soldering system
Designed to meet the needs of the small-batch manufacturer who requires high levels of production flexibility. The Jade Prodex offers the ability to regularly change solder alloys without incurring expensive down time, whilst the solder bath cools down and heats up during a regular manual changeover process.
The Jade Prodex is an offline system, incorporating a quick load, twin PCB, universally adjustable, rotary table transport system to allow simultaneous load / unload during product processing.
Description
As standard, the Jade Prodex is configured with our Duplex twin solder bath arrangement. On independent Z axis drives, this achieves increased production flexibility by permitting the use of two different nozzle tip sizes, which can be allocated as process requirements dictate within any particular area on a PCB.
The Prodex series is controlled by a PC, through PillarCOMM, a Windows® based ‘Point & Click’ interface with a PCB image display.
Additionally, our optional PillarPAD offline programming package allows the operator to produce programs independently from the machine using Gerber data.
Standard Features
- Integral PC and Machine Mounted TFT Monitor
- Duplex Twin Independent Z Axis Solder Pots
- Auto Motorised Wire Solder Feed & Level Detect
- Adjustable Rotary Table Twin Tooling Mechanism
- DC Servo Motor Axis Drive System
- Manual Fiducial Correction System
- Solder Wave Height Measurement System
- Pump RPM Monitoring
- Auto Nozzle Conditioning System
- Process Viewing Camera
- Multilevel Password Security System
- Inerted Nitrogen System
- Drop-Jet fluxer
- Light Stack Tower
- Six AP Style Solder Nozzle Tips
- Flux Level Sensor
- Internal Fume Extraction
- Colour Programming Camera
- PillarCOMM Windows® based ‘Point & Click’ interface
- PillarPAD Offline Programming Package
- Thermal Nozzle Calibration System using Integrated Setting Camera (requires manual correction)
- Solder Pot Coding
- Lead-Free Capability
- Day-To-Day Service Kit
Monitoring Options
- Flux presence sensor – thermistor style
- Flux spray, flow, and spray & flow
- Pump rpm
- O2 ppm
- Nitrogen flow
System Options
- Top side instant IR pre-heat
- Bottom side slide in / out instant IR pre-heat
- Closed-loop pyrometer temperature control
- Bottom side hot Nitrogen selective pre-heat
- Automatic fiducial correction
- Ultrasonic fluxing
- Dual Drop-Jet / ultrasonic fluxing
- Laser PCB warp correction
- Micronozzle assembly
- Large solder bath for dedicated single dip applications
- Solder bath removal trolley
- Solder reel identification
- Larger PCB handling size
- Nitrogen generator
Specifications
- Height: 1208mm / 47.5” to 2025mm / 80”- with light stack
- Width: 1250mm / 49“ to 1460mm / 57”- with rotate
- Depth: 2020mm / 79.5” 2240mm /88” with flux bottles
- Board size: 457mm x 508mm / 18”x 20”
- Edge clearance: Above/below 3mm
- Height clearance: Above/below 40mm nominal 70mm max. top side only
- Solder: Most commonly used solder types – including lead-free
- Solder pot capacity: 20kg standard – 30kg large bath
- Applicators: AP style – 2.5mm to 16mm dia.
- Extended AP style – 2.5mm to 20mm dia.
- Micronozzle – 1.5mm to 2.5mm
- Jet-Tip style – 6mm to 40mm dia.
- Jet-Wave nozzle – up to 25mm width
- Specially dedicated nozzles available upon request
- Flux: Low maintenance Drop-Jet system. Low solids (below 8%), no-clean flux, pressurised and inerted system, optional water-soluble system available
- X, Y & Z Axis resolution: 0.1mm
- Repeatability: +/- 0.05mm
- Nitrogen usage: Up to 40 litres gas/min per bath with standard AP solder nozzle, 5 bar pressure.
- Refer to Pillarhouse for Nitrogen usage requirement with dedicated multi-tube nozzle assemblies.
- Nitrogen purity: 99.995% or better
- Power supplies: Three-phase + neutral + PE
- Voltage: 230 V phase to neutral / 400V phase to phase
- Frequency: 50/60Hz
- Power: Maximum 9kVA per phase machine configuration dependent
- Transport: Handload
- Tooling: Integral adjustable board guides, includes finger extensions and board clamps.
- Programming: PillarCOMM Windows® based ‘Point & Click’ interface
Jade Pro
Ultra-flexible, offline, multi-platform selective soldering system
Designed to meet the needs of the small batch manufacturer who requires high levels of production flexibility. The Jade Pro offers the ability to regularly change solder alloys without incurring expensive down time, whilst the solder bath cools down and heats up during a regular manual changeover process.
Description
The Jade Pro is a handload system, incorporating a universally adjustable tooling carrier capable of accommodating PCBs or pallets up to 457x508mm.
As standard, the Jade Pro is configured with our Duplex twin solder bath arrangement. This twin independent Z axis solder bath arrangement offers increased production flexibility by permitting use of two different nozzle tip sizes within any single process programme, which can be allocated as process requirements dictate within any particular area on a PCB. Alternatively, different solder alloys can be utilised within this single machine setup.
The Jade Pro series is controlled by a PC, through PillarCOMM, a Windows® based ‘Point & Click’ interface with a PCB image display.
Additionally, our PillarPAD offline programming package allows the operator to produce programs independently from the machine using Gerber data.
Standard Features
- Integral PC and Machine Mounted TFT Monitor
- Duplex Twin Independent Z Axis Solder Pots
- Auto Solder Top-Up (Wire Feed) & Solder Level Detect
- DC Servo Drives
- Manual Fiducial Correction System
- Solder Wave Height Measurement & Correction
- Pump RPM Monitoring
- Auto Nozzle Conditioning System
- Process Viewing Camera(s)
- Multilevel Password Security System
- Inerted Nitrogen System
- Drop-Jet fluxer
- Flux Level Sensor
- Light Stack Tower
- Six AP Style Solder Nozzle Tips
- Internal Fume Extraction
- Colour Programming Camera
- Universally Adjustable Tooling Carrier
- PillarCOMM Windows® based ‘Point & Click’ interface
- PillarPAD Offline Programming Package
- Thermal Nozzle Calibration System using Integrated Setting Camera (requires manual correction)
- Solder Pot Coding
- Lead-Free Capability
- Day-To-Day Service Kit
- Initial Solder Fill (63:37 only)
Monitoring Options
- Flux presence sensor – thermistor style
- Flux spray, flow, and spray & flow
- Pump rpm
- O2 ppm
- Nitrogen flow
System Options
- Top side instant IR pre-heat
- Bottom-side slide in / out instant IR pre-heat
- Closed-loop pyrometer temperature control
- Bottom side hot Nitrogen selective pre-heat
- Automatic fiducial correction
- Ultrasonic fluxing
- Dual Drop-Jet / ultrasonic fluxing
- Laser PCB warp correction
- Micronozzle assembly
- Large solder bath for dedicated single dip applications
- Solder bath removal trolley
- Solder reel identification
- Larger PCB handling size
Specifications
- Height: 1230mm / 48” to 2025mm / 80″- with light stack
- Width: 1250mm / 49“ to 1700mm / 67”- with side auto changer
- Depth: 1495mm / 59”1720mm / 68” with flux bottles
- Board size: 457mm x 508mm / 18”x 20”
- Edge clearance: Above / below 3mm
- Height clearance: Above / below 40mm nominal 90mm max. top side only
- Solder: Most commonly used solder types – including lead-free
- Solder pot capacity: 20kg standard – 30kg large bath
- Applicators: AP style – 2.5mm to 16mm dia.
- Extended AP style – 2.5mm to 20mm dia.
- Micronozzle – 1.5mm to 2.5mm
- Jet-Tip style – 6mm to 40mm dia.
- Jet-Wave style – up to 25mm width
- Specially dedicated nozzles available upon request
- Flux: Low maintenance Drop-Jet system. Low solids (below 8%), no-clean flux, pressurised and inerted system, optional water-soluble system available
- X, Y & Z Axis resolution: 0.1mm
- Repeatability: +/- 0.05mm
- Nitrogen usage: Up to 40 litres gas/min per bath with standard AP solder nozzle, 5 bar pressure.
- Refer to Pillarhouse for Nitrogen usage requirement with dedicated multi-tube nozzle assemblies.
- Nitrogen purity: 99.995% or better
- Air supply pressure: 5 bar / 72 psi
- Power supplies: Three-phase + neutral + PE
- Voltage: 230V phase to neutral / 400V phase to phase
- Frequency: 50/60Hz
- Power: Maximum 9kVA per phase machine configuration dependent
- Transport: Handload
- Tooling: Integral adjustable board guides, includes finger extensions and board clamps.
- Programming: PillarCOMM Windows® based ‘Point & Click’ interface
Jade MKIV
Enhanced, entry-level, single point selective soldering system
Designed to meet the needs of the small/medium batch manufacturer who requires high levels of production flexibility, the Jade MKIV offers uncompromised selective soldering quality at a very low cost.
The Jade MKIV is a handload system, incorporating a universally adjustable tooling carrier capable of accommodating PCBs or pallets up to 508mm x 610mm.
Our patented Drop-Jet design fluxer offers quick and effective flushing of the pressurised flux chamber. This helps to keep maintenance levels to a minimum whilst enabling the use of higher solid content fluxes as well as water-soluble fluxes.
Description
As part of the entry-level philosophy for this system, a low maintenance solder bath and pump mechanism has been developed which moves in three axes of movement whilst not limiting access to the PCB. Solder is applied using proven technology through our AP nozzle design or custom specialised nozzles.
As with all Pillarhouse systems, the soldering process is enhanced by a hot Nitrogen curtain which provides an inert atmosphere. This method of soldering also assists in the prevention of oxidisation and provides a local pre-heat to the joint, thus reducing thermal shock to localised components.
The Jade MKIV is controlled by a PC through our next generation PillarCOMMX software, a Windows® based ‘Point & Click’ interface with PCB image display. Additionally, our PillarPAD offline package allows the operator to produce programs independently from the machine using Gerber data.
Standard Features
- Integral PC and Machine Mounted TFT Monitor
- Inerted Nitrogen System
- Auto Motorised Solder Wire Feed and Level Detect
- Drop-Jet fluxer
- Internal Fume Extraction
- Colour Programming Camera
- Universally Adjustable Tooling Carriers
- Manual Fiducial Correction System
- PillarCOMMX Windows® Software
- PillarPAD Offline Programming System
- New Rapid Change Solder Bath and Pump Design
- Pump RPM Monitoring (applicable to mechanical pump only)
- Thermal Nozzle Calibration System using Integrated Setting Camera (requires manual correction)
- Solder Wave Height Measurement
- Process Viewing Camera
- Multilevel Password Security System
- Light Stack Tower
- Lead-Free Compatibility
- Set of AP Style Solder Nozzle Tips
- Accessory Kit
Monitoring Options
- Flux presence sensor – thermistor style
- Flux spray and/or flow
- O2 ppm
- Nitrogen flow
- Nozzle nitrogen purity
System Options
- Ultrasonic fluxing
- Dual Drop-Jet / ultrasonic fluxing
- Top side instant IR pre-heat
- Bottom side slide in/out IR pre-heat
- Closed-loop pyrometer temperature control
- Solder reel identification
- Solder bath coding (identifies correct bath for the program)
- Automatic fiducial recognition and correction system
- Laser PCB warp correction
Specifications
- Height: 2011mm / 79” – including light stack
- Width: 1110mm / 43“
- Depth: 2061mm / 81”
- Board size: Max. – 508mm x 610mm / 20” x 24”
- Edge clearance: Above / below 3mm
- Height clearance: Above 95mm / below 45mm nominal
- Solder: Most commonly used solder types – including lead-free
- Solder pot capacity: 10kg / 22lb
- Applicators: AP style – 2.5mm to 16mm dia.
- Extended AP style – 2.5mm to 20mm dia.
- Micronozzle – 1.5mm to 2.5mm
- Jet-Tip style – 6mm to 40mm dia.
- Jet-Wave nozzle – up to 25mm width
- Specially dedicated nozzles available upon request
- Flux: Low maintenance Drop-Jet system. Low solids (below 8%), no-clean flux, pressurised and inerted system, optional water-soluble system available
- X, Y & Z Axis resolution: 0.15mm
- Repeatability: +/- 0.05mm
- Nitrogen supply pressure: 5 bar / 72 psi
- Nitrogen usage: 30-100 litres/min. / 1.06-3.53 CFM – solder nozzle configuration dependent
- Nitrogen purity: 99.995% or better
- Air supply pressure: 5 bar / 72 psi
- Air usage: 10 litres/min. / 0.35 CFM
- Power supplies: Single phase + PE
- Voltage: 230V
- Frequency: 50/60Hz
- Power: 14.5kVA max. – machine configuration dependent
- Programming: PillarCOMMX Windows® based ‘Point & Click’ interface