Selective Soldering
Jade MKII
Entry-level, single point selective soldering system
Designed to meet the needs of the small/medium batch manufacturer who requires high levels of production flexibility, the Jade MKII entry-level system offers uncompromised selective soldering quality at a very low cost.
The Jade MKII is a handload system, incorporating a universally adjustable tooling carrier capable of accommodating PCBs or pallets up to 457x508mm.
Our patented Drop-Jet design fluxer offers quick and effective flushing of the pressurised flux chamber. This helps to keep maintenance levels to a minimum whilst enabling the use of higher solid content fluxes as well as water-soluble fluxes.
Description
As part of the entry-level philosophy for this system, a low maintenance solder bath and pump mechanism has been developed which moves in three axes of movement whilst not limiting access to the PCB. Solder is applied using proven technology through our AP nozzle design or custom specialised nozzles, incorporating patented spiral solder return to bath technology offering reduced solder balling potential.
As with all Pillarhouse systems, the soldering process is enhanced by a hot Nitrogen curtain which provides an inert atmosphere. This method of soldering also assists in the prevention of oxidisation and provides a local pre-heat to the joint, thus reducing thermal shock to localised components.
The Jade MKII is controlled by a PC through our next generation PillarCOMMX software, a Windows® based ‘Point & Click’ interface with PCB image display. Additionally, our PillarPAD offline package allows the operator to produce programs independently from the machine using Gerber data.
Standard Features
- Integral PC and Machine Mounted TFT Monitor
- Inerted Nitrogen System
- Auto Solder Top-up (Wire Feed) & Solder Level Detect
- Drop-Jet fluxer
- Internal Fume Extraction
- Colour Programming Camera
- Universally Adjustable Tooling Carriers
- Manual Fiducial Correction
- PillarCOMMX Windows® Software
- PillarPAD Offline Programming System
- Thermal Nozzle Calibration System using Integrated Setting Camera (requires manual correction)
- Solder Wave Height Measurement
- Process Viewing Camera
- Multiple Level Password Protection
- Lead-Free Compatibility
- Set of AP Style Solder Nozzle Tips
- Day-to-day Service Kit
Monitoring Options
- Flux presence sensor – thermistor style
- Flux spray, flow, and spray & flow
- Pump rpm
- O2 ppm
- Nitrogen flow
System Options
- Top side instant IR pre-heat
- Closed-loop temperature control – via pyrometer or thermocouple
- Bottom-side IR ring heater
- Bottom-side hot Nitrogen selective pre-heat
- Automatic fiducial correction
- Ultrasonic fluxing
- Dual Drop-Jet / ultrasonic fluxing
- Laser PCB warp correction
- Micronozzle assembly
- Solder reel identification
- Rapid change solder bath and pump system capability – does not include solder bath and pump
- Solder bath coding – identifies correct bath for the program – only suitable for use with rapid change solder bath and pump system
- Encoders on X, Y and Z axis
- Larger PCB handling size
- Nitrogen generator
Specifications
- Height: 1403mm / 55” – excluding light stack
- Width: 1000mm / 40“
- Depth: 1351mm / 53”
- Board size: 457mm x 508mm / 18”x 20” (larger PCB size available upon request)
- Edge clearance: Above / below 3mm
- Height clearance: Above / below 40mm nominal, Above 190mm – special application
- Solder: Most commonly used solder types – including lead-free
- Solder pot capacity: 8kg
- Applicators: AP style – 2.5mm to 16mm dia.
- Extended AP style – 2.5mm to 20mm dia.
- Micronozzle – 1.5mm to 2.5mm
- Jet-Tip style – 6mm to 20mm dia.
- Jet-Wave nozzle – up to 25mm width
- Specially dedicated nozzles available upon request
- Flux: Low maintenance Drop-Jet system. Low solids (below 8%), no-clean flux, pressurised and inerted system, optional water-soluble system available
- X, Y & Z Axis resolution: 0.1mm
- Repeatability: +/- 0.05mm
- Nitrogen usage: 35 litres gas/min. 5 bar pressure
- Nitrogen purity: 99.995% or better
- Air supply pressure: 5 bar / 72 psi
- Power supplies: Single phase + PE
- Voltage: 208V – 250V
- Frequency: 50/60Hz
- Power: 4kVA
- Power with IR pre-heat: 6.5kVA – Top side
- 8kVA – Top with bottom side ring heater
- Transport: Handload
- Tooling: Integral adjustable board guides, includes finger extensions and board clamps
- Programming: PillarCOMMX Windows® based ‘Point & Click’ interface
Pilot
Economical, compact, single point selective soldering system
The all-new ultra-low-cost Pilot machine has been designed as an entry-level, handload, benchtop machine for small to medium batch manufacturers, combining high levels of production flexibility with economic running costs.
Offered with two universal, quick change tooling carriers, each one can be exchanged to optimise cycle time. Each carrier is capable of handling a board size up to 330mm x 250mm.
The Pilot incorporates, as standard, our patented Drop-Jet fluxer for quick, accurate flux deposition. An optional bottom side IR pre-heat is also available; this is particularly useful when processing multi-layer PCBs or using water-based flux types.
Description
Although a low-cost system, the Pilot is offered with the ability to run the acclaimed highly flexible Pillarhouse AP nozzle technology, together with our patented market-leading 1.5mm micronozzle. The process is enhanced by a localised hot Nitrogen environment at the point of soldering. An optional Nitrogen generator is built into the base of the unit and can be used to supply Nitrogen at the required levels, whilst acting as a machine stand.
Designed for low maintenance, the Pilot offers a slide in/out solder bath design for ease of access. This, in conjunction with our proven impellor driven pump technology, makes a highly reliable low maintenance system.
By carrying product over the flux, solder and optional pre-heat stations, the Pilot offers a light, highly accurate X, Y system.
Programming is accessed through the world leading Pillarhouse ‘Point and Click’ PillarCOMMXLITE software package. Optional offline programming is available via PillarPAD, which allows programs to be generated independently from the machine using Gerber data.
Standard Features
- Machine mounted TFT monitor with integral PC
- Inerted Nitrogen system
- Drop-Jet fluxer
- One AP style solder nozzle tip
- Internal fume extraction
- Manual Fiducial Correction System
- Process Viewing Camera
- Colour programming camera
- Two universally adjustable tooling carriers
- PillarPAD offline programming system
- PillarCOMMXLITE – Windows® based ‘Point & Click’ interface
- Solder wave height measurement & correction
- Lead-free compatible
- Day-to-day service kit
System Options
- Fume filtration system
- Micronozzle assembly
- Multiple level password protection
- Bottom side pre-heater
- Combined Nitrogen generator & machine stand
Specifications
- Height With monitor 1050mm / 42”,
- Width: With flux bottles 1090mm / 43”- without 915mm / 36”
- Depth: 700mm / 28” to 963mm / 38” with keypad tray out
- Weight: 170kg (table-top format)
- Board size: 330mm x 250mm / 13″ x 10″
- Edge clearance: Above / below 3mm
- Height clearance: Above / below 40mm nominal
- Solder: Most commonly used solder types – including lead-free
- Solder pot capacity: 6kg
- Applicators: AP style – 2.5mm to 16mm dia.
- Extended AP style – 2.5mm to 20mm dia.
- Micronozzle – 1.5mm to 2.5mm
- Jet-Tip style – 6mm to 20mm dia.
- Special dedicated nozzles available upon request
- Flux: Low maintenance Drop-Jet system. Low solids (below 8%), no clean flux, pressurised and inerted system, optional water-soluble system available
- X, Y & Z Axis resolution: 0.1mm
- Repeatability: +/- 0.05mm
- Nitrogen usage: 30 litres gas/min. 5 bar pressure
- Nitrogen purity: 99.99% or better
- Power supplies: Single phase + PE
- Voltage: 208V – 250V
- Frequency: 50/60Hz
- Power: 4kVA including bottom side IR pre-heat
- Transport: Handload
- Tooling: Integral adjustable board guides, includes finger extensions and board clamps
- Programming: Windows® based PillarCOMMXLITE ‘Point & Click’ interface
Pillarhouse
“Pillarhouse are world leaders in the selective soldering industry, dedicated to the ongoing pioneering of technologies, such as our patented 1.5mm micronozzle, to reflect and match the needs of an everchanging manufacturing marketplace.
We offer a wide range of selective soldering machines, covering the complexity of global demand for production across electronics, aerospace, and PCB contract manufacturing. By combining engineering experience, software development and innovation, Pillarhouse provide cost-effective and reliable selective soldering equipment capable of fluxing, pre-heating, soldering and nitrogen generation.”